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Part Number: IRF7319

 

 

 

 

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRF7319 General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application withdramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques.

IRF7319 Maximum Ratings

  Symbol Maximum Units
N-Channel P-Channel
Drain-Source Voltage VDS 30 -30 V
Gate-Source Voltage VDS ± 20
Continuous Drain Current TA = 25 ID 6.5 -4.9 A
TA = 70 5.2 -3.9
Pulsed Drain Current IDM 30 -30
Continuous Source Current (Diode Conduction) IS 2.5 -2.5
Maximum Power Dissipation TA = 25 PD 2.0 W
TA = 70 1.3
Single Pulse Avalanche Energy EAS 82 140 mJ
Avalanche Current IAR 4.0 -2.8 A
Repetitive Avalanche Energy EAR 0.20 mJ
Peak Diode Recovery dv/dt dv/dt 5.0 -5.0 V/ ns
Junction and Storage Temperature Range TJ, TSTG -55 to + 150  

IRF7319 Features

* Generation V Technology
* Ultra Low On-Resistance
* Dual N and P Channel MOSFET
* Surface Mount
* Fully Avalanche Rated

IRF7319 Connection Diagram

IRF7319  Connection Diagram

IRF7319 datasheet

IRF7319
PDF/DataSheet Download

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