IRF7379PBF

MOSFET

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IRF7379PBF Picture
SeekIC No. : 00153477 Detail

IRF7379PBF: MOSFET

floor Price/Ceiling Price

US $ .3~.84 / Piece | Get Latest Price
Part Number:
IRF7379PBF
Mfg:
International Rectifier
Supply Ability:
5000

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  • 100~250
  • Unit Price
  • $.84
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  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Quick Details

Transistor Polarity : N and P-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : 20 V Continuous Drain Current : 5.8 A
Resistance Drain-Source RDS (on) : 75 mOhms Configuration : Dual Dual Drain
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SOIC-8 Packaging : Tube    

Description

Mounting Style : SMD/SMT
Drain-Source Breakdown Voltage : 30 V
Maximum Operating Temperature : + 150 C
Packaging : Tube
Gate-Source Breakdown Voltage : 20 V
Package / Case : SOIC-8
Transistor Polarity : N and P-Channel
Configuration : Dual Dual Drain
Continuous Drain Current : 5.8 A
Resistance Drain-Source RDS (on) : 75 mOhms


Features:

· Generation V Technology
· Ultra Low On-Resistance
·Complimentary Half Bridge
·Surface Mount
·Fully Avalanche Rated
· Lead-Free



Specifications

  Parameter Max. Units
N-Channel P-Channel
VSD Drain-to-Source Voltage 30

-30

A
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V 5.8 -4.6
ID @ TA = 70°C Continuous Drain Current, VGS @ 10V 4.6 -3.4
IDM Pulsed Drain Current 46 -34
PD @TA = 25°C Power Dissipation 2. W
  Linear Derating Factor 0.02 mW/
VGS Gate-to-Source Voltage ± 20 V
dv/dt Peak Diode Recovery dv/dt 5.0                         -5.0 V/ns
TJ, TSTG Junction and Storage Temperature Range -55 to + 150



Description

Fifth Generation HEXFETs of the IRF7379PbF from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The IRF7379PbF has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques.




Parameters:

Technical/Catalog InformationIRF7379PBF
VendorInternational Rectifier
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN and P-Channel
Drain to Source Voltage (Vdss)30V
Current - Continuous Drain (Id) @ 25° C5.8A, 4.3A
Rds On (Max) @ Id, Vgs45 mOhm @ 5.8A, 10V
Input Capacitance (Ciss) @ Vds 440pF @ 25V
Power - Max2.5W
PackagingBulk
Gate Charge (Qg) @ Vgs25nC @ 10V
Package / Case8-SOIC (3.9mm Width)
FET Feature*
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names IRF7379PBF
IRF7379PBF



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