MFG:IR Package Cooled:SO8 D/C:06+
MFG: IR
Package Cooled: SO8
D/C: 06+
Description: Fifth Generation HEXFET® power MOSFETs from International Rectifier utilize advanced processing te...
Fifth Generation HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The SO-8 has been modified through a customized leadframe for enhanced thermal characterstics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infrared or wave soldering techniques. Power dissipation of greater than 0.8 W is possible in a typical PCB mount application.
| Parameter | Symbol | Max. | Unit |
| Continuous Drain Current, VGS @ -10V,Ta = 25 | ID | 6.8 | A |
| Continuous Drain Current, VGS @ -10V,Ta = 70 | ID | 5.4 | A |
| Pulsed Drain Current*1 | IDM | 54 | A |
| Power Dissipation Ta = 25 | PD | 2.5 | W |
| Power Dissipation Ta = 70 | PD | 1.6 | W |
| Linear Derating Factor | 0.02 | /mW | |
| Gate-to-Source Voltage | VGS | ±12 | V |
| Peak Diode Recovery dv/dt | dv/dt | 5.0 | mJ |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 to + 150 |
IRF034
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