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MFG:IR  Package Cooled:SMD  

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Part Number: IRF7403

 

MFG: IR

Package Cooled: SMD

 

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRF7403 General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.

The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.

IRF7403 Maximum Ratings

  Parameter Max. Units
ID @ TA = 25°C Continuous Drain Current, VGS @ -10V 9.7 A
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V 8.5 A
ID @ TA = 70°C Continuous Drain Current, VGS @ -10V 5.4 A
IDM Pulsed Drain Current 34 A
PD @TA = 25°C Maximum Power Dissipation 2.5 W
  Linear Derating Factor 0.02 mW/°C
VGS Gate-to-Source Voltage ± 20 V
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ , TSTG Junction and Storage Temperature Range -55 to + 150 °C

IRF7403 Features

· Generation V Technology
·Ultra Low On-Resistance
· N-Channel Mosfet
· Surface Mount
· Available in Tape & Reel
· Dynamic dv/dt Rating
· Fast Switching

IRF7403 datasheet

IRF7403
PDF/DataSheet Download

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