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IRF7413RbF

Features: ·Generation VTechnology·Ultra Low On-Resistance·Surface Mount·Available in Tape & Reel·Dynamic dv/dt Rating·Fast Switching·100% RG Tested·Lead-FreeSpecifications Symbol Parameter Max Units VDS Drain-to-Source Voltage 30 V VGS Gate-to-Source Voltage ± 20...

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SeekIC No. : 004376766 Detail

IRF7413RbF: Features: ·Generation VTechnology·Ultra Low On-Resistance·Surface Mount·Available in Tape & Reel·Dynamic dv/dt Rating·Fast Switching·100% RG Tested·Lead-FreeSpecifications Symbol Paramet...

IRF7413RbF Data Sheet

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Part Number:
IRF7413RbF
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

·Generation VTechnology
·Ultra Low On-Resistance
·Surface Mount
·Available in Tape & Reel
·Dynamic dv/dt Rating
·Fast Switching
·100% RG Tested
·Lead-Free


Specifications

Symbol
Parameter
Max
Units
VDS Drain-to-Source Voltage
30
V
VGS Gate-to-Source Voltage
± 20
ID @ TA = 25 Continuous Drain Current, VGS @ 10V
13
A
ID @ TA = 70 Continuous Drain Current, VGS @ 10V
9.2
IDM Pulsed Drain Current 􀀀
58
PD @TA = 25 Power Dissipation
2.5
W
  Linear Derating Factor
0.02
mW/
EAS Single Pulse Avalanche Energency
260
mJ
dv/dt Peak Diode Recovery dv/dt
5.0
V/ns
TJ, TSTG Junction and Storage Temperature Range
-55 to +150



Description

Fifth Generation HEXFETs of the IRF7413RbF from lnternational Rectifierutilize advanced pro cessing techniques to achieve extremely low on-resistance per siling speed and ruggedized device with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are wellknown for,provides the designer with an extremely efficient and reliable device for use in awide variety of applications.

The SO-8 of the IRF7413RbF has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capabilty making it ideal in a variety of power applications,With these improvements,multiple devices can be used in an application with dramatically reduced board space.The package is designed for vapor phase,infra red,or wave soldering techniques.Power dissipation of greater than 0.8W is possible in a typical PCB mount application.




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