IRF7503

Pinout






Specifications

	Parameter	Max.	Units
ID @ TA = 25	Continuous Drain Current, VGS @ 10V	2.4	A
ID @ TA = 70	Continuous Drain Current, VGS @ 10V	1.9
IDM	Pulsed Drain Current	14
PD @ TA = 25	Power Dissipation	1.25	W
	Linear Derating Factor	10	mW/
VGS	Gate-to-Source Voltage	± 20	V
dv/dt	Peak Diode Recovery dv/dt	5.0	V/ns
TJ, TSTG	Junction and Storage Temperature Range	-55 to + 150

Description

Fifth Generation HEXFETs of the IRF7503 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The new Micro8 package of the IRF7503, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards.