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MFG:IR  Package Cooled:06+  D/C:TSSOP-8  

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Part Number: IRF7705

 

MFG: IR

Package Cooled: 06+

D/C: TSSOP-8

Description: HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low ...


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IRF7705 General Description


HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design, that International Rectifier is well known for, provides the designer with an extremely efficient and reliable device for use in battery and load management.

The TSSOP-8 package has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.2mm) allows it to fit easily into extremely thin environments such as portable electronics and PCMCIA cards.

IRF7705 Maximum Ratings

  Parameter Max. Units
VDS Drain- Source Voltage -30 V
ID @ TC = 25 Continuous Drain Current, VGS @ -10V -8.0 A
ID @ TC = 70 Continuous Drain Current, VGS @ -10V -6.0
IDM Pulsed Drain Current -30
PD @TC = 25 Power Dissipation 1.5 W
PD @TC = 70 Power Dissipation 0.96
  Linear Derating Factor 0.012 W/
VGS Gate-to-Source Voltage ±20 V
TJ, TSTG Junction and Storage Temperature Range -55 to + 150

IRF7705 Features

·Ultra Low On-Resistance
·P-Channel MOSFET
·Very Small SOIC Package
·Low Profile ( < 1.2mm)
·Available in Tape & Reel

IRF7705 Connection Diagram

IRF7705 Connection Diagram

 

IRF7705 datasheet

IRF7705
PDF/DataSheet Download

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Related Part Number

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