MOSFET N-Chan 800V 4.1 Amp
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| Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 800 V | ||
| Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 4.1 A | ||
| Resistance Drain-Source RDS (on) : | 3 Ohms | Configuration : | Single | ||
| Maximum Operating Temperature : | + 150 C | Mounting Style : | Through Hole | ||
| Package / Case : | TO-262 | Packaging : | Tube |
|
Parameter |
Max. |
Units | |
|
ID @ TC = 25 |
Continuous Drain Current, VGS @ 10V |
4.1 |
A |
|
ID @ TC = 100 |
Continuous Drain Current, VGS @ 10V |
2.6 | |
|
IDM |
Pulsed Drain Current |
16 | |
|
PD @TC = 25 |
Maximum Power Dissipation |
125 |
W |
|
Linear Derating Factor |
1.0 |
W/ | |
|
VGS |
Gate-to-Source Voltage |
± 20 |
V |
|
EAS |
Single Pulse Avalanche Energy (Thermally Limited) |
260 |
mJ |
|
IAR |
Avalanche Current |
4.1 |
A |
|
EAR |
Repetitive Avalanche Energy |
13 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt |
2.0 |
V/ns |
|
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 150 |
|
|
Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) | ||
|
Mounting torque, 6-32 or M3 screw |
10 lbf•in (1.1N•m) |
Third Generation HEXFETs of the IRFBE30L from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.