MOSFET N-Chan 800V 4.1 Amp
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| Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 800 V | ||
| Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 4.1 A | ||
| Resistance Drain-Source RDS (on) : | 3 Ohms | Configuration : | Single | ||
| Maximum Operating Temperature : | + 150 C | Mounting Style : | Through Hole | ||
| Package / Case : | TO-262 | Packaging : | Tube |
| Parameter | Max. | Units | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V | 4.1 | A |
| ID @ TC =100 | Continuous Drain Current, VGS @ 10V | 2.6 | |
| IDM | Pulsed Drain Current | 16 | |
| PD @TC = 25 | Maximum Power Dissipation | 125 | W |
| Linear Derating Factor | 1.0 | W/ | |
| VGS | Gate-to-Source Voltage | ± 20 | V |
| EAS | Single Pulse Avalanche Energy (Thermally Limited) | 260 | mJ |
| IAR | Avalanche Current | 4.1 | A |
| EAR | Repetitive Avalanche Energy | 13 | mJ |
| dv/dt | Peak Diode Recovery dv/dt | 2.0 | V/ns |
| TJ,TSTG | Operating Junction and Storage Temperature Range | -55 to + 150 | |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) | ||
| Mounting torque, 6-32 or M3 screw | 10 lbf•in (1.1N•m) |
Third Generation HEXFETs of the IRFBE30LPbF from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.