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MFG:200 Package Cooled:IOR


Part Number: IRFL214
MFG: 200
Package Cooled: IOR
Description: Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast swit...
MFG:200 Package Cooled:IOR


MFG: 200
Package Cooled: IOR
Description: Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast swit...
Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The SOT-223 package is designed for surface-mounting using vapor phase, infrared, or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performace due to an enlarged tab for heatsinking. Power dissipation of greater than 1.25 W is possible in a typical surface mount application.
| PARAMETER | SYMBOL | LIMIT | UNIT | ||
| Drain-Source Voltage | VDS | 250 | V | ||
| Gate-Source Voltage | VGS | ± 20 | |||
| Continuous Drain Current | VGS at 10 V | TC = 25 °C | ID | 0.79 | A |
| TC = 100 °C | 0.50 | ||||
| Pulsed Drain Currenta | IDM | 6.3 | |||
| Linear Derating Factor | 0.025 | W/ | |||
| Linear Derating Factor (PCB Mount)e | 0.017 | W/ | |||
| Single Pulse Avalanche Energyb | EAS | 50 | mJ | ||
| Repetitive Avalanche Currenta | IAR | 0.79 | A | ||
| Repetitive Avalanche Energya | EAR | 0.31 | mJ | ||
| Maximum Power Dissipation (PCB Mount)e | TA = 25 °C | PD | 3.1 | W | |
| Maximum Power Dissipation | TC = 25 °C | 2.0 | W | ||
IRFL214
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