Features: · Ultra Low Gate Charge· Reduced Gate Drive Requirement· Enhanced 30V Vgs Rating· Reduced Ciss, Coss, Crss· Isolated Central Mounting Hole· Dynamic dv/dt Rated· Repetitive Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, V GS ...
IRFPC60LC-P: Features: · Ultra Low Gate Charge· Reduced Gate Drive Requirement· Enhanced 30V Vgs Rating· Reduced Ciss, Coss, Crss· Isolated Central Mounting Hole· Dynamic dv/dt Rated· Repetitive Avalanche RatedS...
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|
Parameter |
Max. |
Units | |
| ID @ TC = 25°C | Continuous Drain Current, V GS @ 10V |
15 |
A |
| ID @ TC = 100°C | Continuous Drain Current, V GS @ 10V |
10 | |
| IDM | Pulsed Drain Current |
64 | |
| PD @TC = 25°C | Power Dissipation |
280 |
W |
| Linear Derating Factor |
2.2 |
W/°C | |
| VGS | Gate-to-Source Voltage |
±20 |
V |
| EAS | Single Pulse Avalanche Energy |
1000 |
mJ |
| IAR | Avalanche Current |
16 |
A |
| EAR | Repetitive Avalanche Energy |
28 |
mJ |
| dv/dt | Peak Diode Recovery dv/dt |
3.0 |
V/ns |
| TJ |
Operating Junction and |
-55to+150 |
|
| TSTG | Storage Temperature Range |
°C | |
| Maximum Reflow Temperature |
225 |
|
Parameter |
Typ. |
Max. |
Units | |
| RJC | Junction-to-Case |
- |
0.45 |
°C/W |
| RCS | Case-to-Sink, Flat, Greased Surface |
0.24 |
- | |
| RJA | Junction-to-Ambient |
- |
40 |
This new series of Surface Mountable Low Charge HEXFET Power MOSFETs achieve significantly lower gate charge over conventional MOSFETs. Utilizing advanced Hexfet technology the device of the IRFPC60LC-P improvements allow for reduced gate drive requirements, faster switching speeds and increased total system savings.These device improvements combined with the proven ruggedness and reliability of HEXFETs offer the designer a new standard in power transistors for switching applications.