Features: • 3.3A, 200V, RDS(on) = 1.5 @VGS = 10 V• Low gate charge ( typical 7.2 nC)• Low Crss ( typical 6.8 pF)• Fast switching• 100% avalanche tested• Improved dv/dt capabilitySpecifications Symbol Parameter IRF610B IRFS610B Units VDSS Drain-Sourc...
IRFS610B: Features: • 3.3A, 200V, RDS(on) = 1.5 @VGS = 10 V• Low gate charge ( typical 7.2 nC)• Low Crss ( typical 6.8 pF)• Fast switching• 100% avalanche tested• Improved ...
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| Symbol | Parameter | IRF610B | IRFS610B | Units | |
| VDSS | Drain-Source Voltage | 200 | V | ||
| ID | Drain Current | - Continuous (TC = 25°C) | 3.3 | 3.3 * | A |
| - Continuous (TC = 100°C) | 2.1 | 2.1* | A | ||
| IDM | Drain Current - Pulsed (Note 1) | 10 | 10* | A | |
| VGSS | Gate-Source Voltage | ± 30 | V | ||
| EAS | Single Pulsed Avalanche Energy (Note 2) | 40 | mJ | ||
| IAR | Avalanche Current (Note 1) | 3.3 | A | ||
| EAR | Repetitive Avalanche Energy (Note 1) | 3.8 | mJ | ||
| dv/dt | Peak Diode Recovery dv/dt (Note 3) | 5.5 | V/ns | ||
| PD | Power Dissipation (TC = 25°C) - Derate above 25°C |
38 | 22 | W | |
| 0.31 | 0.18 | W/°C | |||
| TJ, TSTG | Operating and Storage Temperature Range | -55 to +150 | °C | ||
| TL | Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds |
300 | °C | ||