Features: ·Avalanche Rugged Technology·Rugged Gate Oxide Technology·Lower Input Capacitance·Improved Gate Charge·Extended Safe Operating Area·Lower Leakage Current : 10 A (Max.) @ VDS = 500V·Lower RDS(ON) : 1.169 (Typ.)Specifications SYMBOL PARAMETER VALUE UNIT VDSS Drain-Source Voltag...
IRFS830A: Features: ·Avalanche Rugged Technology·Rugged Gate Oxide Technology·Lower Input Capacitance·Improved Gate Charge·Extended Safe Operating Area·Lower Leakage Current : 10 A (Max.) @ VDS = 500V·Lower R...
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SYMBOL | PARAMETER | VALUE | UNIT |
VDSS | Drain-Source Voltage | 200 | V |
ID | Continuous Drain Current (TC=25 ) | 3.1 | A |
Continuous Drain Current (TC=100) | 2 | A | |
IDM | Drain Current-Pulsed | 18 | A |
VGS | Gate-to-Source Voltage | ±30 | V |
EAS | Single Pulsed Avalanche Energy | 374 | mJ |
IAR | Avalanche Current | 3.1 | A |
EAR | Repetitive Avalanche Energy | 3.8 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 3.5 | V/ns |
PD | Total Power Dissipation (TC=25) Linear Derating Factor |
38 0.3 |
W |
TJ , TSTG | Operating Junction and Storage Temperature Range |
- 55 to +150 | |
TL | Maximum Lead Temp. for Soldering Purposes, 1/8 " from case for 5-seconds |
300 |