Features: Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current: 10mA (Max.) @ VDS = 500V Lower RDS(ON): 0.638W (Typ.)Specifications Symbol Parameter Value Units VDSS Drain to Source Vol...
IRFW/I840A: Features: Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current: 10mA (Max.) @ VDS = 500V Lower RD...
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Features: Avalanche Rugged TechnologyRugged Gate Oxide TechnologyLower Input CapacitanceImproved G...
Features: Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improv...
Symbol | Parameter | Value | Units |
VDSS | Drain to Source Voltage | 500 | V |
ID | Continuous Drain Current(@TC = 25) | 8 | A |
Continuous Drain Current(@TC = 100) | 5.1 | ||
IDM | Drain Current Pulsed (1) | 32 | A |
VGS | Gate to Source Voltage | ±30 | V |
EAS | Single Pulsed Avalanche Energy (2) | 640 | mJ |
IAR | Avalanche Current (1) | 8 | A |
EAR | Repetitive Avalanche Energy (1) | 14.2 | mJ |
dv/dt | Peak Diode Recovery dv/dt (3) | 3.5 | V/ns |
PD | Total Power Dissipation(TA = 25 )* | 3.1 | W |
Derating Factor above (TC = 25 ) | 142 1.14 |
W W/ | |
TSTG, TJ | Operating Junction and Storage Temperature Range |
- 55 to +150 | |
TL | Maximum Lead Temp. for Soldering Purposes, 1/8 from case for 5-seconds |
300 |
* When mounted on the minimum pad size recommended (PCB Mount).