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IRG4PC60F-P

Features: • Fast: Optimized for medium operating frequencies ( 1-5 kHz in hard switching, >20 kHz in resonant mode).• Generation 4 IGBT design provides tighter parameter distribution and higher efficiency.• Solder plated version of industry standard TO-247AC package.Specificat...

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SeekIC No. : 004377719 Detail

IRG4PC60F-P: Features: • Fast: Optimized for medium operating frequencies ( 1-5 kHz in hard switching, >20 kHz in resonant mode).• Generation 4 IGBT design provides tighter parameter distribution ...

IRG4PC60F-P Data Sheet

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Part Number:
IRG4PC60F-P
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Fast: Optimized for medium operating frequencies ( 1-5 kHz in hard switching, >20 kHz in resonant mode).
• Generation 4 IGBT design provides tighter parameter distribution and higher efficiency.
• Solder plated version of industry standard TO-247AC package.


Specifications

 
Parameter
Max.
Units
VCES Collector-to-Emitter Breakdown Voltage
600
V
IC @ TC = 25°C Continuous Collector Current
90
A
IC @ TC = 100°C Continuous Collector Current
60
ICM Pulsed Collector Current
120
ILM Clamped Inductive Load Current
120
VGE Gate-to-Emitter Voltage
± 20
V
EARV Reverse Voltage Avalanche Energy
200
mJ
PD @ TC = 25°C Maximum Power Dissipation
520
W
PD @ TC = 100°C Maximum Power Dissipation
210
TJ
TSTG		 Operating Junction and
Storage Temperature Range
-55 to + 150
°C
  Soldering Temperature, for 10 seconds
300 (0.063 in. (1.6mm) from case)
  Mounting torque, 6-32 or M3 screw
10 lbf•in (1.1N•m)
°C
  Maximum Reflow Temperature 230 (Time above 183°C
should not exceed 100s)
Thermal Resistance
 
Parameter
Typ.
Max.
Units
RJC Junction-to-Case
-
0.24
°C/W
RCS Case-to-Sink, Flat, Greased Surface
0.24
-
RJA Junction-to-Ambient (Typical Socket Mount)
-
40
RJA Junction-to-Ambient (PCB Mount, Steady State)
-
20
  
Wt Weight
6 (0.21)
-
g(oz)



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