Features: •NPT Technology, Positive Temperature Coefficient•Lower VCE(SAT)•Lower Parasitic Capacitances•Minimal Tail Current•HEXFRED Ultra Fast Soft-Recovery Co-Pack Diode•Tighter Distribution of Parameters•Higher ReliabilityApplication•Telecom and S...
IRGP50B60PD1: Features: •NPT Technology, Positive Temperature Coefficient•Lower VCE(SAT)•Lower Parasitic Capacitances•Minimal Tail Current•HEXFRED Ultra Fast Soft-Recovery Co-Pack Di...
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Features: • UltraFast Non Punch Through (NPT) Technology• 10 µs Short Circuit ca...
| Parameter | Max. | Units | |
| VCES | Collector-to-Emitter Voltage | 600 | V |
| IF@ TC= 25° | CContinuous Collector Current | 75 | A |
| IF@ TC= 100° | CContinuous Collector Current | 45 | A |
| ICM | Pulsed Collector Current | 150 | A |
| ICM | Clamped Inductive Load Current | 150 | A |
| IF@ TC= 25° | 40 | A | |
| IF@ TC= 100° | CDiode Continuous Forward Current | 15 | A |
| LSM | Diode Maximum Forward Current | 60 | A |
| VGE | Gate-to-Emitter Voltage | ± 20 | V |
| PD@ TC= 25° | CMaximum Power Dissipation | 390 | W |
| PD@ TC= 100° | CMaximum Power Dissipation | 156 | W |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to +150 | °C |
| Soldering Temperature, for 10 sec. | 300 (0.063 in. (1.6mm) from case) |