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Part Number: IRKT26

 

 

 

 

Description: The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage o...


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IRKT26 General Description


The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals are secured against axial pull-out:they are fixed to the module housing via a click-stop feature
already tested and proved as reliable on other IR modules.

IRKT26 Features

·High Voltage
·Industrial Standard Package
·Thick Al metal die and double stick bonding
·Thick copper baseplate
·UL E78996 approved
·3500VRMS isolating voltage

IRKT26 datasheet

IRKT26
PDF/DataSheet Download

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