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Part Number: IRKT71_10AS90

 

 

 

 

Description: The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded C...


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IRKT71_10AS90 General Description


The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals are secured against axial pull-out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.

IRKT71_10AS90 Features

High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500VRMS isolating voltage

IRKT71_10AS90 datasheet

IRKT71/10AS90
PDF/DataSheet Download

  • Datasheet: IRKT71/10AS90
  • File Size: 327060 KB
  • Manufacturer: IRF [International Rectifier]
  • Click here to Download

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