·High Voltage ·Industrial Standard Package ·Thick Al metal die and double stick bonding ·Thick copper baseplate ·UL E78996 approved ·3500VRMS isolating voltage
The Generation V of Add-A-pak module IRKU/V91combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the ...
The Generation V of Add-A-pak module IRKU/V71, 91 SERIES combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom ...
The Generation V of Add-A-pak module IRKU/V71 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the...
The Generation V of Add-A-pak module IRKU/V105 SERIES combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior me-chanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom si...
The Generation V of Add-A-pak IRKU/V105 module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of th...
These series of INT-A-pak modules IRKTF82 are intended for applications such as self-commutated inverters, DC choppers, electronic welders, induction heating and others where fast switching characteristics are required.