IRKU/V71

Features: ·High Voltage·Industrial Standard Package·Thick Al metal die and double stick bonding·Thick copper baseplate·UL E78996 approved·3500VRMS isolating voltageDescriptionThe Generation V of Add-A-pak module IRKU/V71 combine the excellent thermal performance obtained by the usage of Direct Bon...

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SeekIC No. : 004378283 Detail

IRKU/V71: Features: ·High Voltage·Industrial Standard Package·Thick Al metal die and double stick bonding·Thick copper baseplate·UL E78996 approved·3500VRMS isolating voltageDescriptionThe Generation V of Add...

floor Price/Ceiling Price

Part Number:
IRKU/V71
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/24

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Product Details

Description



Features:

·High Voltage
·Industrial Standard Package
·Thick Al metal die and double stick bonding
·Thick copper baseplate
·UL E78996 approved
·3500VRMS isolating voltage



Description

The Generation V of Add-A-pak module IRKU/V71 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

The Cu baseplate IRKU/V71 allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module IRKU/V71 is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals IRKU/V71 are secured against axial pull-out:they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.




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