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Part Number: IRKU105_16AS90

 

 

 

 

Description: The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage o...


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IRKU105_16AS90 General Description


The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior me- chanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of sur-face roughness and improve thermal spread.The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals are secured against axial pull- out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.

IRKU105_16AS90 Features

High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
RMS isolating voltage

IRKU105_16AS90 datasheet

IRKU105/16AS90
PDF/DataSheet Download

  • Datasheet: IRKU105/16AS90
  • File Size: 120759 KB
  • Manufacturer: IRF [International Rectifier]
  • Click here to Download

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