Purchase IRKU105_16AS90, In-stock IRKU105_16AS90 From SeekIC.


Part Number: IRKU105_16AS90
Description: The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage o...


Description: The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage o...
The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior me- chanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of sur-face roughness and improve thermal spread.The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.
The electrical terminals are secured against axial pull- out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.
IRKU105/16AS90
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