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MFG:IR  Package Cooled:D2-PAK  D/C:09+  

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Part Number: IRL1004S

 

MFG: IR

Package Cooled: D2-PAK

D/C: 09+

Description: Fifth Generation HEXFET® power MOSFETs from International Rectifier utilize advanced processing te...


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IRL1004S General Description


Fifth Generation HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRL1004L) is available for lowprofile application.

IRL1004S Maximum Ratings

  Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 130 A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 92 A
IDM Pulsed Drain Current 520 A
PD @ TA = 25°C Power Dissipation 3.8 W
PD @TC = 25°C Power Dissipation 200 W
  Linear Derating Factor 1.3 W/°C
VGS Gate-to-Source Voltage ±16 V
EAS Single Pulse Avalanche Energy 700 mJ
IAR Avalanche Current 78 A
EAR Repetitive Avalanche Energy 20 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ,TSTG Operating Junction
Storage Temperature Range
-55 to 175
  Soldering Temperature, for 10 seconds 300 (1.6mm from case)

IRL1004S Features

·Advanced Process Technology
·Ultra Low On-Resistance
·Dynamic dv/dt Rating
·175°C Operating Temperature
·Fast Switching
·Fully Avalanche Rated

IRL1004S datasheet

IRL1004S
PDF/DataSheet Download

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