MFG:IR Package Cooled:TO-220 D/C:05+
MFG: IR
Package Cooled: TO-220
D/C: 05+
Description: The FETKY family of copackaged HEXFET power MOSFETs and Schottky Diodes offer the designer an innovati...
The FETKY family of copackaged HEXFET power MOSFETs and Schottky Diodes offer the designer an innovative board space saving solution for switching regulator applications. A low on resistance Gen 5 MOSFET with a low forward voltage drop Schottky diode and minimized component interconnect inductance and resistance result in maximized converter efficiencies.
The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.
| Parameter |
Max. |
Units | |
| ID @ TC = 25°C | Continuous Drain Current, VGS @10V |
64 |
|
| ID @ TC = 100°C | Continuous Drain Current, VGS @10V |
45 |
A |
| IDM | Pulsed Drain Current |
220 |
|
| PD @TA = 25°C | Power Dissipation |
2.0 |
|
| PD @TC = 25°C | Power Dissipation |
89 |
W |
| Linear Derating Factor |
0.56 |
W/°C | |
| VGS | Gate-to-Source Voltage |
±16 |
V |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 150 |
°C |
| Soldering Temperature, for 10 seconds |
300 (1.6mm from case) |
||
| Mounting torque, 6-32 or M3 screw. |
10 lbf•in (1.1N•m) |
IRL3103D1
PDF/DataSheet Download
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