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Part Number: IRL3803VSPbF
Description: Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing...


Description: Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing...
Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connectionresistance and can dissipate up to 2.0W in a typical surface mount application.
| Parameter |
Max. |
Units | |
| ID @ TC = 25 | Continuous Drain Current,VGS @ 10V |
140 |
A |
| ID @ TC = 100 | Continuous Drain Current,VGS @ 10V |
110 | |
| IDM | Pulsed Drain Current |
470 | |
| PD @ TC = 25 | Power Dissipation |
3.8 |
W |
| PD @ TC = 25 | Power Dissipation |
200 | |
| Linear Derating Factor |
1.4 |
W/ | |
| VGS | Gate-to-Source Voltage |
±16 |
V |
| IAR | Avalanche Current |
71 |
A |
| EAR | Repetitive Avalanche Energy |
20 |
mJ |
| dv/dt | Peak Diode Recovery dv/dt |
5.0 |
V/ns |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to 175 |
|
| Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) |
IRL1004
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