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MFG:IR  Package Cooled:SOT-223  D/C:05+  

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Part Number: IRLL3303PbF

 

MFG: IR

Package Cooled: SOT-223

D/C: 05+

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRLL3303PbF General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve  extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques.

Its unique package design allows for easy automatic pickand- place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application.

IRLL3303PbF Maximum Ratings

  Parameter Max. V
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V** 6.5 A
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V* 4.6
ID @ TA = 70°C Continuous Drain Current, VGS @ 10V* 3.7
IDM Pulsed Drain Current 37
PD @TA = 25°C Power Dissipation (PCB Mount)** 2.1 W
PD @TA = 25°C Power Dissipation (PCB Mount)* 1.0 W/°C
  Linear Derating Factor (PCB Mount)* 8.3 V
VGS Gate-to-Source Voltage ± 16 V
EAS Single Pulse Avalanche Energy 140 mJ
IAR Avalanche Current 4.6 A
EAR Repetitive Avalanche Energy 0.10 mJ
TJ, TSTG Junction and Storage Temperature Range -55 to + 150 °C
dv/dt Peak Diode Recovery dv/dt 1.3 V/ns

IRLL3303PbF Features

· Surface Mount
· Dynamic dv/dt Rating
· Logic-Level Gate Drive
· Fast Switching
· Ease of Paralleling
· Advanced Process Technology
· Ultra Low On-Resistance
· Lead-Free

IRLL3303PbF datasheet

IRL1004
PDF/DataSheet Download

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