IS61DDB21M36

Features: • 1M x 36 or 2M x 18.• On-chip delay-locked loop (DLL) for wide data valid window.• Common data input/output bus.• Synchronous pipeline read with self-timed late write operation.• Double data rate (DDR-II) interface for read and write input ports.• Fix...

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SeekIC No. : 004379135 Detail

IS61DDB21M36: Features: • 1M x 36 or 2M x 18.• On-chip delay-locked loop (DLL) for wide data valid window.• Common data input/output bus.• Synchronous pipeline read with self-timed late wr...

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Part Number:
IS61DDB21M36
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 1M x 36 or 2M x 18.
• On-chip delay-locked loop (DLL) for wide data valid window.
• Common data input/output bus.
• Synchronous pipeline read with self-timed late write operation.
• Double data rate (DDR-II) interface for read and write input ports.
• Fixed 2-bit burst for read and write operations.
• Clock stop support.
• Two input clocks (K and K) for address and control registering at rising edges only.
• Two input clocks (C and C) for data output control.
• Two echo clocks (CQ and CQ) that are delivered simultaneously with data.
• +1.8V core power supply and 1.5, 1.8V VDDQ, used with 0.75, 0.9V VREF.
• HSTL input and output levels.
• Registered addresses, write and read controls, byte writes, data in, and data outputs.
• Full data coherency.
• Boundary scan using limited set of JTAG 1149.1 functions.
• Byte write capability.
• Fine ball grid array (FBGA) package
- 15mm x 17mm body size
- 1mm pitch
- 165-ball (11 x 15) array
• Programmable impedance output drivers via 5x user-supplied precision resistor.



Specifications

Item Symbol Rating Units
Power supply voltage

Output power supply voltage
VDD

VDDQ
-0.5 to 2.6

-0.5 to 2.6
V

V
Input voltage

Data out voltage
VIN

VDOUT
-0.5 to 2.6

-0.5 to 2.6
V

V
Operating temperature

Junction temperature

Storage temperature
TA

TJ

TSTG
0 to 70

110

-55 to +125




Note: Stresses greater than those listed in this table can cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other onditions above those indicated in the operational sections of this datasheet is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.



Description

The 36Mb IS61DDB21M36 and IS61DDB22M18 are synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have a common I/O bus. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed.

Refer to the Timing Reference Diagram for Truth Table on page 8 for a description of the basic operations of these DDR-II (Burst of 2) CIO SRAMs.

The input addresses are registered on all rising edges of the K clock. The DQ bus operates at double data rate for reads and writes. The following are registered internally on the rising edge of the K clock:
• Read and write addresses
• Address load
• Read/write enable
• Byte writes
• Data-in

The following are registered on the rising edge of the K clock:
• Byte writes
• Data-in for second burst addresses

Byte writes can change with the corresponding datain to enable or disable writes on a per-byte basis. An internal write buffer enables the data-ins to be registered one cycle later than the write address. The first data-in burst is clocked with the rising edge of the next K clock, and the second burst is timed to the following rising edge of the K clock.

During the burst read operation, at the first burst the data-outs are updated from output registers off the second rising edge of the C clock (1.5 cycles later).

At the second burst, the data-outs are updated with the third rising edge of the corresponding C clock (see page 9). The K and K clocks are used to time the data-outs whenever the C and C clocks are tied high.

The device is operated with a single +1.8V power supply and is compatible with HSTL I/O interfaces.




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