IXFC 96N15P

Features: · Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation· Low drain to tab capacitance(<35pF)· Low RDS (on) HDMOSTM process· Rugged polysilicon gate cell structure· Unclamped Inductive Switching (UIS) rated· Fast ...

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IXFC 96N15P Picture
SeekIC No. : 004381517 Detail

IXFC 96N15P: Features: · Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation· Low drain to tab capacitance(<35pF)· Low RDS (on) HDMOS...

floor Price/Ceiling Price

Part Number:
IXFC 96N15P
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/4/27

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Product Details

Description



Features:

· Silicon chip on Direct-Copper-Bond substrate
  - High power dissipation
  - Isolated mounting surface
  - 2500V electrical isolation
· Low drain to tab capacitance(<35pF)
· Low RDS (on) HDMOSTM process
· Rugged polysilicon gate cell structure
· Unclamped Inductive Switching (UIS) rated
· Fast intrinsic Rectifier



Application

· DC-DC converters
· Battery chargers
· Switched-mode and resonant-mode power supplies
· DC choppers
· AC motor control



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