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Part Number: K4H560438E-GCC4

 

 

 

 

 

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K4H560438E-GCC4 Maximum Ratings

Parameter Symbol Value Unit
Voltage on any pin relative to VSS
VIN  , VOUT
-0.5 ~ 3.6 V
Voltage on V DD& V  DDQsupply relative to VSS
 
V DD, VDDQ
 
-1.0 ~ 3.6 V
Storage temperature TSTG
-55 ~ +150  
Power dissipation PD
1.5 W
Short circuit current IOS
50 mA

K4H560438E-GCC4 Features

* 200MHz Clock, 400Mbps data rate.
* VDD= +2.6V ±0.10V, VDDQ= ±2.6V + 0.10V
* Double-data-rate architecture; two data transfers per clock cycle
* Bidirectional data strobe [DQ] (x4,x8) 
* Four banks operation
* Differential clock inputs(CK and CK)
* DLL aligns  DQ and DQS transition with CK transition
* MRS cycle with address key programs  -. Read latency  3 (clock) for DDR400 , 2.5 (clock) for DDR333 -. Burst length (2, 4, 8)  -. Burst type (sequential & interleave)
* All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
* Data I/O transactions on both edges of data strobe
* Edge aligned data output, center aligned data input
* DM for write masking only (x4, x8)
* Auto & Self refresh
* 7.8us refresh interval(8K/64ms refresh)
* Maximum burst refresh cycle : 8
* 60Ball FBGA package

K4H560438E-GCC4 datasheet

K4H560438E-GCC4
PDF/DataSheet Download

  • Datasheet: K4H560438E-GCC4
  • File Size: 202651 KB
  • Manufacturer: SAMSUNG [Samsung semiconductor]
  • Click here to Download

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