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LWM1070N3

Features: • Package : SMD Top View Type (3 Chip in 1PKG)• 8.0 × 7.2 × 1.4 mm(L×W×H) size surface mount type• Viewing angle : extremely wide(120˚)• Technology : InGaN• Soldering methods : IR reflow soldering• ESD FreeSpecifications Item Symbol A...

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SeekIC No. : 004403396 Detail

LWM1070N3: Features: • Package : SMD Top View Type (3 Chip in 1PKG)• 8.0 × 7.2 × 1.4 mm(L×W×H) size surface mount type• Viewing angle : extremely wide(120˚)• Technology : InGaNR...

LWM1070N3 Data Sheet

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Part Number:
LWM1070N3
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/17

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Product Details

Description



Features:

• Package : SMD Top View Type (3 Chip in 1PKG)
• 8.0 × 7.2 × 1.4 mm(L×W×H) size surface mount type
• Viewing angle : extremely wide(120˚)
• Technology : InGaN
• Soldering methods : IR reflow soldering
• ESD Free




Specifications

Item
Symbol
Absolute Maximum Rating
Unit
Forward Current
IF
90
mA
*1Pulse Forward Current
IFP
300
mA
Power Dissipation
PD
270
mW
Junction Temperature
Tj
110
Operating Temperature
Topr
-30∼+85
Storage Temperature
Tstg
-40∼+100
Soldering Temperature
Tsol
Reflow Soldering : 260
for 10 sec.
Hand Soldering : 350
for 3 sec.
*1. IFP Conditions : Pulse Width 10msec. and Duty 1/10




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