Le57D11

Note:
1. Thermal limiting circuitry on-chip will shut down the circuit at a junction temperature of about 165º C. The device should never see this temperature, and operation above 145º C junction temperature may degrade device reliability. See the SLIC Packaging Considerations for more information.
2. Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.

The innovative Le57D11 Dual Channel SLIC device was designed for high-density POTS applications requiring a small footprint SLIC device with significant power savings. By combining the line interface of two channels into one SLIC device, the Le57D11 device enables the design of a low cost, high performance, and fully programmable line interface for multiple country applications worldwide. The on-chip Thermal Management (TMG) feature allows for significantly reduced power dissipation on the device. Another benefit is that it is offered in space-saving package types 44-pin eTQFP and 32- pin PLCC. The small footprint of the SLIC device allows designers to save board space, increasing the density of lines on the board. The Le57D11 device is also designed to significantly reduce the number of external components required for line card design.

Legerity offers a range of compatible SLAC devices that perform the codec function in a line card. In particular, the Legerity Quad SLAC device combined with the Le57D11 device provides a programmable line circuit that can be configured for varying requirements.