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Part Number: M36D0R6040T0

 

 

 

 

Description: The M36D0R6040T0 and M36D0R6040B0 combine two memory devices in a Multi-Chip Package: a 64-Mbit, Multiple Bank Flash me...


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M36D0R6040T0 General Description


The M36D0R6040T0 and M36D0R6040B0 combine two memory devices in a Multi-Chip Package: a 64-Mbit, Multiple Bank Flash memory, the M58WR064FT/B, and a 16-Mbit Pseudo SRAM, the M69AR024B. Recommended operating conditions do not allow more than one memory to be active at the same time.

The memory is offered in a Stacked TFBGA67 (12 x 8mm, 8x8 ball array, 0.8mm pitch) package. In addition to the standard version, the packages are also available in Lead-free version, in compliance with JEDEC Std J-STD-020B, the ST ECOPACK 7191395 Specification, and the RoHS (Restriction of Hazardous Substances) directive.

All packages are compliant with Lead-free soldering processes.

The memory is supplied with all the bits erased (set to '1').

M36D0R6040T0 Maximum Ratings

Symbol Parameter Value Unit
Min Max
TA Ambient Operating Temperature 30 85 °C
TBIAS Temperature Under Bias -40 125 °C
TSTG Storage Temperature -65 155 °C
TLEAD Lead Temperature during Soldering   (1) °C
VIO Input or Output Voltage -0.5 VDD(1)+0.6 V
VDDF Flash Memory Core Supply Voltage -0.2 2.45 V
VDDP PSRAM Supply Voltage -0.2 2.45 V
VPPF Flash Memory Program Voltage -0.2 14 V
IO Output Short Circuit Current   100 mA
tVPPFH Time for VPPF at VPPFH   100 hours

M36D0R6040T0 Features

`MULTI-CHIP PACKAGE
1 die of 64 Mbit (4Mb x 16) Flash Memory
1 die of 16 Mbit (1Mb x 16) Pseudo SRAM

`SUPPLY VOLTAGE
VDDF = VDDP = 1.7V to 1.95V

`LOW POWER CONSUMPTION
`ELECTRONIC SIGNATURE
Manufacturer Code: 20h
Device Code (Top Flash Configuration), M36D0R6040T0: 8810h
Device Code (Bottom Flash Configuration), M36D0R6040B0: 8811h

`PACKAGE
Compliant with Lead-Free Soldering Processes
Lead-Free Versions

`PROGRAMMING TIME
8µs by Word typical for Fast FactoryProgram
Double/Quadruple Word Program option
Enhanced Factory Program options

`MEMORY BLOCKS
Multiple Bank Memory Array: 4 Mbit Banks
Parameter Blocks (Top location)

`ASYNCHRONOUS READ
Asynchronous Page Read mode
Random Access: 70ns

`DUAL OPERATIONS
Program Erase in one Bank while Read in others
No delay between Read and Write operations

`BLOCK LOCKING
All blocks locked at Power-up
Any combination of blocks can be locked
WPF for Block Lock-Down

`SECURITY
128-bit user programmable OTP cells
64-bit unique device number

`COMMON FLASH INTERFACE (CFI)
`100,000 PROGRAM/ERASE CYCLES per BLOCK
`ACCESS TIME: 70ns
`LOW STANDBY CURRENT: 110µA
`DEEP POWER DOWN CURRENT: 10µA

M36D0R6040T0 Connection Diagram

M36D0R6040T0  Connection Diagram

M36D0R6040T0 datasheet

M36D0R6040T0
PDF/DataSheet Download

  • Datasheet: M36D0R6040T0
  • File Size: 336947 KB
  • Manufacturer: STMICROELECTRONICS [STMicroelectronics]
  • Click here to Download

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