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Part Number: M38K09RFS
Description: The 38K0 group is the 8-bit microcomputer based on the 740 family core technology.The 38K0 group has the USB fu...
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M38K09RFS
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General Description
M38K09RFS General Description
The 38K0 group is the 8-bit microcomputer based on the 740 family core technology.
The 38K0 group has the USB function, an 8-bit bus interface, a Serial I/O, three 8-bit timers, and an 8-channel 10-bit A-D converter, which are available for the PC peripheral I/O device.
The various microcomputers in the 38K0 group include variations of internal memory size and packaging. For details, refer to the section on part numbering.
M38K09RFS Maximum Ratings
| Symbol | Parameter | Conditions | Ratings | Unit | |
| VCC | Power source voltage | All voltages are based on VSS. Output transistors are cut off. |
0.3 to 6.5 | V | |
| AVCC | Analog power source voltage VCCE, VREF, PVCC, DVCC, USBVREF |
0.3 to VCC + 0.3 | V | ||
| VI | Input voltage P00P07, P10P17, P20P27, P30 P37, P40P43, P50P57, P60P63 |
0.3 to VCC + 0.3 | V | ||
| VI | Input voltage RESET, XIN, CNVSS2 | 0.3 to VCC + 0.3 | V | ||
| VI | Input voltage CNVSS | Mask ROM version | 0.3 to VCC + 0.3 | V | |
| Flash memory version | 0.3 to 6.5 | V | |||
| VI | Input voltage D0+, D0- | 0.5 to 3.8 | V | ||
| VO | Output voltage P00P07, P10P17, P20P27, P30 P37, P40P43, P50P57, P60P63,XOUT |
0.3 to VCC + 0.3 | V | ||
| VO | Output voltage D0+, D0-, TrON | 0.5 to 3.8 | V | ||
| Pd | Power dissipation (Note) | Ta = 25°C | 500 | mW | |
| Topr | Operating temperature | MCU operating | 20 to 85 | °C | |
| In flash memory mode (For flash memory version) |
25±5 | °C | |||
| Tstg | Storage temperature | 40 to 125 | °C | ||
M38K09RFS Features
•Basic machine-language instructions ....................................... 71
•The minimum instruction execution time .......................... 0.25 s (at 8 MHz system clock*)
System clock*: Reference frequency to internal circuit except USB function
•Memory size
ROM ................................................................ 16 K to 32 K bytes
RAM ............................................................... 1024 to 2048 bytes
•Programmable input/output ports ............................................. 48
•Software pull-up resistors
•Interrupts .................................................. 15 sources, 15 vectors
•USB function (USB version 1.1 specification) ........... 4 endpoints
•External bus interface ....................................... 8-bit * 1 channel
•Timers ............................................................................. 8-bit * 3
•Watchdog timer ............................................................. 16-bit *1
•Serial I/O ...................... 8-bit *1 (UART or Clock-synchronized)
•A-D converter ................................................ 10-bit *8 channels (8-bit reading available)
•LED direct drive port ................................................................... 4
•Clock generating circuit (connect to external ceramic resonator or quartz-crystal oscillator)
•Power source voltage
System clock/Internal clock division mode
At 12 MHz/Through mode ( = 12 MHz) ................ 4.50 to 5.25 V (under planning)
At 12 MHz/2-divide mode( = 6 MHz) ................... 4.00 to 5.25 V (under development)
At 8 MHz/Through mode ( = 8 MHz) ................... 4.00 to 5.25 V
At 6 MHz/Through mode ( = 6 MHz) ................... 4.00 to 5.25 V
At 6 MHz/Through mode ( = 6 MHz) ................... 3.00 to 4.00 V (under development)
Remarks: The mode under development will be available from Aug./2002.
•Power dissipation
At 5 V power source voltage .................................. 125 mW (typ.) (at 8 MHz system clock, in through mode)
At 3.3 V power source voltage ................................ 45 mW (typ.) (at 6 MHz system clock, in through mode)
•Operating temperature range .................................... 20 to 85°C
•Packages
FP ........................................ 64P6U-A (64-pin 14 *14 mm LQFP)
HP ........................................ 64P6Q-A (64-pin 10 *10 mm LQFP)
•The minimum instruction execution time .......................... 0.25 s (at 8 MHz system clock*)
System clock*: Reference frequency to internal circuit except USB function
•Memory size
ROM ................................................................ 16 K to 32 K bytes
RAM ............................................................... 1024 to 2048 bytes
•Programmable input/output ports ............................................. 48
•Software pull-up resistors
•Interrupts .................................................. 15 sources, 15 vectors
•USB function (USB version 1.1 specification) ........... 4 endpoints
•External bus interface ....................................... 8-bit * 1 channel
•Timers ............................................................................. 8-bit * 3
•Watchdog timer ............................................................. 16-bit *1
•Serial I/O ...................... 8-bit *1 (UART or Clock-synchronized)
•A-D converter ................................................ 10-bit *8 channels (8-bit reading available)
•LED direct drive port ................................................................... 4
•Clock generating circuit (connect to external ceramic resonator or quartz-crystal oscillator)
•Power source voltage
System clock/Internal clock division mode
At 12 MHz/Through mode ( = 12 MHz) ................ 4.50 to 5.25 V (under planning)
At 12 MHz/2-divide mode( = 6 MHz) ................... 4.00 to 5.25 V (under development)
At 8 MHz/Through mode ( = 8 MHz) ................... 4.00 to 5.25 V
At 6 MHz/Through mode ( = 6 MHz) ................... 4.00 to 5.25 V
At 6 MHz/Through mode ( = 6 MHz) ................... 3.00 to 4.00 V (under development)
Remarks: The mode under development will be available from Aug./2002.
•Power dissipation
At 5 V power source voltage .................................. 125 mW (typ.) (at 8 MHz system clock, in through mode)
At 3.3 V power source voltage ................................ 45 mW (typ.) (at 6 MHz system clock, in through mode)
•Operating temperature range .................................... 20 to 85°C
•Packages
FP ........................................ 64P6U-A (64-pin 14 *14 mm LQFP)
HP ........................................ 64P6Q-A (64-pin 10 *10 mm LQFP)
M38000E1-XXXFP
PDF/DataSheet Download
- Datasheet: M38000E1-XXXFP
- File Size: 2447095 KB
- Manufacturer: MITSUBISHI [Mitsubishi Electric Semiconductor]
- Click here to Download
- ·M38000E1-XXXFS
- MITSUBISHI [Mitsubishi Electric Semiconductor]
- 8-BIT SINGLE-CHIP MICROCOMPUTER
- 4303892 KB
- ·M38000E1-XXXHP
- MITSUBISHI [Mitsubishi Electric Semiconductor]
- 8-BIT SINGLE-CHIP MICROCOMPUTER
- 4303892 KB
- ·M38000E1-XXXSP
- MITSUBISHI [Mitsubishi Electric Semiconductor]
- 8-BIT SINGLE-CHIP MICROCOMPUTER
- 4303892 KB
- ·M38000E1-XXXSS
- MITSUBISHI [Mitsubishi Electric Semiconductor]
- 8-BIT SINGLE-CHIP MICROCOMPUTER
- 4303892 KB
- ·M38000E2-XXXFP
- MITSUBISHI [Mitsubishi Electric Semiconductor]
- 8-BIT SINGLE-CHIP MICROCOMPUTER
- 2447095 KB
- ·M38000E2-XXXFS
- MITSUBISHI [Mitsubishi Electric Semiconductor]
- 8-BIT SINGLE-CHIP MICROCOMPUTER
- 2447095 KB
- ·M38000E2-XXXHP
- MITSUBISHI [Mitsubishi Electric Semiconductor]
- 8-BIT SINGLE-CHIP MICROCOMPUTER
- 4303892 KB
- ·M38000E2-XXXSP
- MITSUBISHI [Mitsubishi Electric Semiconductor]
- 8-BIT SINGLE-CHIP MICROCOMPUTER
- 4303892 KB
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