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Part Number: M48T08Y,

 

 

 

 

Description: The M48T08/18/08Y TIMEKEEPER® RAM is an 8K x 8 non-volatile static RAM and real time cl...


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M48T08Y, General Description


The M48T08/18/08Y TIMEKEEPER® RAM is an 8K x 8 non-volatile static RAM and real time clock which is pin and functional compatible with the DS1643. The monolithic chip is available in two special packages to provide a highly integrated battery backed-up memory and real time clock so-lution.

The M48T08/18/08Y is a non-volatile pin and func-tion equivalent to any JEDEC standard 8K x 8 SRAM. It also easily fits into many ROM, EPROM,and EEPROM sockets, providing the non-volatility of PROMs without any requirement for special WRITE timing or limitations on the number of WRITEs that can be performed.

The 28-pin, 600mil DIP CAPHAT™ houses the M48T08/18/08Y silicon with a quartz crystal and a long- life lithium button cell in a single package.

The 28-pin, 330mil SOIC provides sockets with gold plated contacts at both ends for direct con-nection to a separate SNAPHAT® housing con-taining the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process. Inser-tion of the SNAPHAT housing after reflow pre-vents potential battery and crystal damage due to the high temperatures required for device surface-mounting. The SNAPHAT housing is keyed to pre- vent reverse insertion.

The SOIC and battery/crystal packages are shipped separately in plastic anti-static tubes or in Tape & Reel form. For the 28 lead SOIC, the bat-tery/crystal package (e.g., SNAPHAT) part num-ber is "M4T28-BR12SH" or "M4T32-BR12SH"(see Table 17, page 24).

M48T08Y, Maximum Ratings

Symbol Parameter Value Unit
TA Operating Temperature 15 to 75
TSTG Storage Temperature (VCC, Oscillator Off) 40 to 85
TSLD(1,2) Lead Solder Temperature for 10 seconds 260
VCC Supply Voltage (on any pin relative to Ground) 0.3 to 7 V
VIO Input or Output Voltage 0.3 to 7 V
IO Output Current 20 mA
PD Power Dissipation 1 W

Note: 1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
2. For SO package: Reflow at peak temperature of 215°C to 225°C for < 60 seconds (total thermal budget not to exceed 180°C for between 90 to 120 seconds).

M48T08Y, Features

` INTEGRATED ULTRA LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT, and BATTERY
` BYTEWIDE™ RAM-LIKE CLOCK ACCESS
` BCD CODED YEAR, MONTH, DAY, DATE, HOURS, MINUTES, and SECONDS
` TYPICAL CLOCK ACCURACY OF ±1 MINUTE A MONTH, AT 25°C
` AUTOMATIC POWER-FAIL CHIP DESELECT and WRITE PROTECTION
` WRITE PROTECT VOLTAGES (VPFD = Power-fail Deselect Voltage):
M48T08: VCC = 4.75 to 5.5V
4.5V VPFD 4.75V
M48T18/T08Y: VCC = 4.5 to 5.5V
4.2V VPFD 4.5V
` SOFTWARE CONTROLLED CLOCK CALIBRATION FOR HIGH ACCURACY APPLICATIONS
` SELF-CONTAINED BATTERY and CRYSTAL IN THE CAPHAT™ DIP PACKAGE
` PACKAGING INCLUDES A 28-LEAD SOIC and SNAPHAT® TOP
` (to be Ordered Separately)
` SOIC PACKAGE PROVIDES DIRECT CONNECTION FOR A SNAPHAT TOP WHICH CONTAINS THE BATTERY and CRYSTAL
` PIN and FUNCTION COMPATIBLE WITH DS1643 and JEDEC STANDARD 8K x 8 SRAMs

M48T08Y, Connection Diagram

M48T08Y,  Connection Diagram

M48T08Y, datasheet

M485L1624FT0
PDF/DataSheet Download

  • Datasheet: M485L1624FT0
  • File Size: 270388 KB
  • Manufacturer: SAMSUNG [Samsung semiconductor]
  • Click here to Download

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