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M48T59V

Features: INTEGRATED ULTRA LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT and BATTERYFREQUENCY TEST OUTPUT for REAL TIME CLOCK SOFTWARE CALIBRATIONAUTOMATIC POWER-FAIL CHIP DESELECT and WRITE PROTECTIONWRITE PROTECT VOLTAGES (VPFD = Power-fail Deselect Voltage): M48T59: 4.5V VPFD 4.7...

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SeekIC No. : 004405392 Detail

M48T59V: Features: INTEGRATED ULTRA LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT and BATTERYFREQUENCY TEST OUTPUT for REAL TIME CLOCK SOFTWARE CALIBRATIONAUTOMATIC POWER-FAIL CHIP DESELECT and...

M48T59V Data Sheet

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Part Number:
M48T59V
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/28

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Product Details

Description



Features:

INTEGRATED ULTRA LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT and BATTERY
FREQUENCY TEST OUTPUT for REAL TIME CLOCK SOFTWARE CALIBRATION
AUTOMATIC POWER-FAIL CHIP DESELECT and WRITE PROTECTION
WRITE PROTECT VOLTAGES (VPFD = Power-fail Deselect Voltage):
  M48T59: 4.5V  VPFD 4.75V
  M48T59Y: 4.2V VPFD 4.5V
  M48T59V: 2.7V VPFD 3.0V
SELF-CONTAINED BATTERY and CRYSTAL in the CAPHAT DIP PACKAGE
PACKAGING INCLUDES a 28-LEAD SOIC and SNAPHAT® TOP (to be Ordered Separately)
SOIC PACKAGE PROVIDES DIRECT CONNECTION for a SNAPHAT TOP which CONTAINS the BATTERY and CRYSTAL
MICROPROCESSOR POWER-ON RESET (Valid even during battery back-up mode)
PROGRAMMABLE ALARM OUTPUT ACTIVE in the BATTERY BACK-UP MODE
BATTERY LOW FLAG


Pinout

Connection Diagram


Specifications

Symbol Parameter Value Unit
TA Ambient Operating Temperature Grade 1 0 to 70 °C
Grade 6 40 to 85
TSTG Storage Temperature (VCC Off, Oscillator Off) 40 to 85 °C
TSLD (2) Lead Solder Temperature for 10 seconds 260 °C
VIO Input or Output Voltages 0.3 to 7 V
VCC Supply Voltage M48T59/M48T59Y 0.3 to 7 V
M48T59V 0.3 to 4.6
IO Output Current 20 mA
PD Power Dissipation 1 W
Note:
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect reliability.
2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
CAUTION: Negative undershoots below 0.3V are not allowed on any pin while in the Battery Back-up mode.
CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.


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