M48Z35AVMH

The M48Z35AVMH belongs to M48Z35AY/35AV family which is a 32 Kbit x8 non-volatile static RAM that integrates power-fail deselect circuitry and battery control logic on a single die. The monolithic chip of M48Z35AVMH is available in two special packages to provide a highly in- tegrated battery backed-up memory solution.

The features of M48Z35AVMH can be summarized as (1)integrated ultra low power SRAM, power-fail control circuit and battery; (2)read cycle time equals write cycle time; (3)battery low flag (BOK); (4)automatic power-fail chip deselect and write protection; (5)write protect voltages (VPFD = power-fail deselect voltage): M48Z35AY: 4.20V VPFD 4.50V, M48Z35AV: 2.7V VPFD 3.0V; (6)self-contained battery in the caphat dip package; (7)packaging includes a 28-lead soic and snaphat top (to be ordered separately); (8)soic package provides direct connection for a snaphat top which contains the battery and crystal; (9)pin and function compatible with JEDEC standard 32k x8 SRAMs.

The absolute maximum ratings of M48Z35AVMH are (1)TA ambient operating temperature Grade1/Grade6: 0 to 70/-40 to 85°C; (2)TSTG storage temperature (VCC Off)SNAPHAT/SOIC: -40 to 85/-55 to 125°C; (3)TSLD (2) lead solder temperature for 10 seconds: 260 °C; (4)VIO input or output voltages: -0.3 to 7 V; (5)VCC supply voltage: -0.3 to 7 V; (6)IO output current: 20 mA; (7)PD power dissipation: 1 W(Note: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect reliability. 2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).).