MAX1908

DCIN, CSSP, CSSN, ACOK to GND..........................-0.3V to +30V
BST to GND............................................................-0.3V to +36V
BST to LX.................................................................-0.3V to +6V
DHI to LX..................................................-0.3V to (VBST + 0.3V)
LX to GND ................................................................-6V to +30V
BATT, CSIP, CSIN to GND .....................................-0.3V to +20V
CSIP to CSIN or CSSP to CSSN or PGND
    to GND.............................................................-0.3V to +0.3V
   CCI, CCS, CCV, DLO, ICHG,
IINP, ACIN, REF to GND...........................-0.3V to (VLDO + 0.3V)
DLOV, VCTL, ICTL, REFIN, CELLS, CLS,
LDO, SHDN to GND .................................................-0.3V to +6V
DLOV to LDO........................................................-0.3V to +0.3V
DLO to PGND .........................................-0.3V to (VDLOV + 0.3V)
LDO Short-Circuit Current...................................................50mA
Continuous Power Dissipation (T_A = +70°C)
   28-Pin Thin QFN (5mm * 5mm)
   (derate 20.8mW/°C above +70°C) .......................1666.7mW
Operating Temperature Range .........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range ...........................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.