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Part Number: MAX3229

 

 

 

 

Description: The MAX3228/MAX3229 are +2.5V to +5.5V powered EIA/TIA-232 and V.28/V.24 communications interfaces wit...


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MAX3229 General Description


The MAX3228/MAX3229 are +2.5V to +5.5V powered EIA/TIA-232 and V.28/V.24 communications interfaces with low power requirements, and high data-rate capabilities, in a chip-scale package (UCSP™).

The MAX3228/MAX3229 achieve a 1µA supply current with Maxim's AutoShutdown™ feature. They save power without changes to existing BIOS or operating systems by entering low-power shutdown mode when the RS-232 cable is disconnected, or when the transmitters of the connected peripherals are off.

The transceivers have a proprietary low-dropout transmitter output stage, delivering RS-232 compliant performance from a +3.1V to +5.5V supply, and RS-232 compatible performance with a supply voltage as low as +2.5V. The dual charge pump requires only four small 0.1µF capacitors for operation from a +3.0V supply. Each device is guaranteed to run at data rates of 250kbps while maintaining RS-232 output levels.

The MAX3228/MAX3229 offer a separate power-supply input for the logic interface, allowing configurable logic levels on the receiver outputs and transmitter inputs. Operating over a +1.65V to VCC range, VL provides the MAX3228/MAX3229 compatibility with multiple logic families.

The MAX3229 contains one receiver and one transmitter. The MAX3228 contains two receivers and two transmitters. The MAX3228/MAX3229 are available in tiny chip-scale packaging and are specified across the extended industrial temperature range of -40°C to +85°C.

MAX3229 Maximum Ratings

VCC to GND...........................................................-0.3V to +6.0V
V+ to GND ............................................................-0.3V to +7.0V
V- to GND .............................................................+0.3V to -7.0V
V+ to |V-| (Note 1) ..............................................................+13V
VL to GND..............................................................-0.3V to +6.0V
Input Voltages
T_IN, FORCEON, FORCEOFF to GND..............-0.3V to (VL + 0.3V)
R_IN to GND ......................................................................±25V
Output Voltages
T_OUT to GND ................................................................±13.2V
R_OUT to GND..............................................-0.3V to (VL + 0.3V)
INVALID to GND.........................................-0.3V to (VCC + 0.3V)
Short-Circuit Duration T_OUT to GND........................Continuous
Continuous Power Dissipation (TA = +70°C)
6 × 5 UCSP (derate 10.1mW/°C above TA = +70°C)...805mW
Operating Temperature Range .......................-40°C to +85°C
Junction Temperature...................................................+150°C
Storage Temperature Range ........................-65°C to +150°C
Bump Temperature (Soldering) (Note 2)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended
in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating
is required. Hand or wave soldering is not allowed.

MAX3229 Features

·6 × 5 Chip-Scale Packaging (UCSP)
·1µA Low-Power AutoShutdown
·250kbps Guaranteed Data Rate
·Meets EIA/TIA-232 Specifications Down to +3.1V
·RS-232 Compatible to +2.5V Allows Operation from Single Li+ Cell
·Small 0.1µF Capacitors
·Configurable Logic Levels

MAX3229 Typical Application

·Personal Digital Assistants
·Cell Phone Data Lump Cables
·Set-Top Boxes
·Hand-Held Devices
·Cell Phones

MAX3229 datasheet

MAX3229
PDF/DataSheet Download

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