MAX4733

V+.........................................................................................-0.3V to +12V
IN_, COM_, NO_, NC_ (Note 1)....................................-0.3V to (V+ + 0.3V)
Continuous Current (any pin) ........................................................±10mA
Peak Current (any pin, pulsed at 1ms, 10% duty cycle) ................±20mA
Continuous Power Dissipation (T_A = +70°C)
8-Pin µMAX (derate 4.5mW/°C above +70°C) ............................362mW
9-Bump UCSP (derate 4.7mW/°C above +70°C).........................379mW
Operating Temperature Range .....................................-40°C to +85°C
Storage Temperature Range ......................................-65°C to +150°C
Maximum Junction Temperature .................................................+150°C
Lead Temperature (soldering, 10s) ............................................+300°C
Bump Temperature (soldering, Note 2)
Infrared (15s) ............................................................................+220°C
Vapor Phase (60s) .....................................................................+215°C
Note 1: Signals on IN_, NO_, NC_, or COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed.