MAX6639

VCC to GND...........................................................-0.3V to +6V
PWM1, PWM2, TACH1, and TACH2 to GND ......-0.3V to +13.5V
DXP1 and DXP2 to GND.........................-0.3V to +(V_CC + 0.3V)
DXN to GND ......................................................-0.3V to +0.8V
SCL, SDA, THERM, OT, FANFAIL, ADD,
and ALERT to GND ..............................................-0.3V to +6V
SDA, OT, THERM, ALERT, FANFAIL,
PWM1, and PWM2 Current .............................-1mA to +50mA
DXN Current ..................................................................±1mA
ESD Protection (all pins, Human Body Model) ...............2000V
Continuous Power Dissipation (T_A = +70°C)
16-Pin QSOP (derated 8.3mW/°C above +70°C) .... 667mW
16-Pin TQFN 5mm x 5mm
(derated at 33.3mW/°C above +70°C)................2666.7mW
Operating Temperature Range ..................-40°C to +125°C
Junction Temperature.................................................+150°C
Storage Temperature Range .....................-65°C to +150°C
Lead Temperature (soldering, 10s) ...........................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.