MAX9315

V_CC - V_EE...............................................................................4.1V
Inputs (CLK_, CLK_, SEL, EN)
to V_EE ...............................................(V_EE - 0.3V) to (V_CC + 0.3V)
CLK_ to CLK_ ....................................................................±3.0V
Continuous Output Current ...............................................50mA
Surge Output Current.......................................................100mA
VBB Sink/Source Current ..............................................±0.65mA
Continuous Power Dissipation (T_A = +70°C)
Single-Layer PC Board
20-Pin TSSOP (derate 7.69mW/°C above +70°C) .......615mW
Multilayer PC Board
20-Pin TSSOP (derate 10.9mW/°C above +70°C) .......879mW
Junction-to-Ambient Thermal Resistance in Still Air
Single-Layer PC Board
20-Pin TSSOP ...........................................................+130°C/W
Multilayer PC Board
20-Pin TSSOP .............................................................+91°C/W
Junction-to-Ambient Thermal Resistance with 500LFPM
Airflow Single-Layer PC Board
20-Pin TSSOP ............................................................+9.6°C/W
Junction-to-Case Thermal Resistance
20-Pin TSSOP ...................................................v.........+20°C/W
Operating Temperature Range ........................-40°C to +85°C
Junction Temperature....................................................+150°C
Storage Temperature Range .........................-65°C to +150°C
ESD Protection
Human Body Model (Inputs and Outputs) .........................2kV
Soldering Temperature (10s) ........................................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.