MBF200

The Fujitsu MBF200 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor composed of a twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate of a capacitor and the ontacting finger acts as the second plate. A passivation layer on the device surface forms the dielectric between these two plates. Ridges and valleys on the finger yield varying capacitor values across the array, and the resulting varying discharge voltages are read to form an image of the fingerprint.

The MBF200 is manufactured in standard CMOS technology. The 256 X 300 sensor array has a 50 m pitch and yields a 500-dpi image. The sensor surface is protected by a patented, ultra-hard, abrasion and chemical resistant coating.