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Part Number: MBM29SL800TE

 

 

 

 

Description: The MBM29SL800TE/BE are a 8 M-bit, 1.8 V-only Flash memory organized as 1 Mbytes of 8 bits each or 512...


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MBM29SL800TE General Description


The MBM29SL800TE/BE are a 8 M-bit, 1.8 V-only Flash memory organized as 1 Mbytes of 8 bits each or 512 Kwords of 16 bits each. The MBM29SL800TE/BE are offered in a 48-ball FBGA and 45-ball SCSP packages. These devices are designed to be programmed in-system with the standard system 1.8 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard PROM programmers.

MBM29SL800TE Maximum Ratings

Symbol Parameter Rating Unit
min. max.
Tstg Storage Temperature -55 +125
TA Ambient Temperature with Power Applied -40 +85
VIN, VOUT Voltage with Respect to Ground All pins except A9,
OE, and RESET *1, *2
-0.3 VCC + 0.5 V
VIN A9, OE, and RESET *1, *3 -0.3 +11.5 V
VCC Power Supply Voltage *1 -0.5 +3.0 V

*1: Voltage is defined on the basis of VSS = GND = 0 V.
*2:Minimum DC voltage on input or I/O pins is −0.3 V. During voltage transitions, input or I/O pins may undershoot
VSS to −2.0 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC + 0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC + 2.0 V for periods of up to 20 ns.

*3:Minimum DC input voltage on A9, OE and RESET pins is −0.3 V. During voltage transitions, A9, OE and RESET
pins may undershoot VSS to −2.0 V for periods of up to 20 ns. Voltage difference between input and supply voltage
(VIN - VCC) does not exceed +9.0 V. Maximum DC input voltage on A9, OE and RESET pins is +11.5 V which may overshoot to +12.5 V for periods of up to 20 ns.

WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.

MBM29SL800TE Features

• 0.23 µ µ µ µm Process Technology
• Single 1.8 V read, program, and erase
   Minimizes system level power requirements
• Compatible with JEDEC-standard world-wide pinouts
   48-ball FBGA (Package suffix : PBT)
   45-ball SCSP (Package suffix : PW)
• Minimum 100,000 program/erase cycles
• High performance
   90 ns maximum access time
• Sector erase architecture
   One 8 Kword, two 4 Kwords, one 16 Kword, and fifteen 32 Kwords sectors in word mode
   One 16 Kbyte, two 8 Kbytes, one 32 Kbyte, and fifteen 64 Kbytes sectors in byte mode
   Any combination of sectors can be concurrently erased. Also supports full chip erase
• Boot Code Sector Architecture
   T = Top sector
   B = Bottom sector
• Embedded EraseTM Algorithms
   Automatically pre-programs and erases the chip or any sector
• Embedded ProgramTM Algorithms
   Automatically writes and verifies data at specified address
Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
   Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
   When addresses remain stable, automatically switch themselves to low power mode
• Erase Suspend/Resume
   Suspends the erase operation to allow a read in another sector within the same device
• Sector protection
   Hardware method disables any combination of sectors from program or erase operations
• Sector Protection set function by Extended sector Protect command
• Fast programming Function by Extended Command
• Temporary sector unprotection
   Temporary sector unprotection via the RESET pin

Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.

MBM29SL800TE datasheet

MBM29SL800TE-10PBT
PDF/DataSheet Download

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