Purchase MC33975, In-stock MC33975 From SeekIC.


Part Number: MC33975
Description: Freescale offers multiple Switch Detection Interface Devices. The 33975 Multiple Switch Detection Inte...


Description: Freescale offers multiple Switch Detection Interface Devices. The 33975 Multiple Switch Detection Inte...
Freescale offers multiple Switch Detection Interface Devices. The 33975 Multiple Switch Detection Interface with Suppressed Wake-Up is designed to detect the closing and opening of up to 22 switch contacts. The switch status, either open or closed, is transferred to the microprocessor unit (MCU) through a serial peripheral interface (SPI). The device also features a 22-to-1 analog multiplexer for reading inputs as analog.
The 33975 device has two modes of operation, Normal and Sleep.Normal mode allows programming of the device and supplies switch contacts with pull-up or pull-down current as it monitors switch change of state. The Sleep mode provides low quiescent current, which makes the 33975 ideal for automotive and industrial products requiring low sleep state currents.
Improvements are a programmable interrupt timer for Sleep mode that can be disabled, switch detection currents of 32 mA and 4.0 mA for switch-to-ground inputs, and an interrupt bit that can be reset.
| Rating | Symbol | Value | Unit |
| Electrical Ratings | |||
| VDD Supply Voltage (1) | - | - 0.3 to 7.0 | VDC |
| CS, SI, SO, SCLK, INT, AMUX | - | - 0.3 to 7.0 | VDC |
| WAKE | - | -0.3 to 40 | VDC |
| VPWR Supply Voltage | - | -0.3 to 50 | VDC |
| Switch Input Voltage Range MC33975 PC339775A |
- | -14 to 38 -14 to 40 |
VDC |
| Frequency of SPI Operation (VDD = 5.0 V) | - | 6.0 | MHz |
| ESD Voltage (1) Human Body Model (2) Applies to all non-input terminals Machine Model Charge Device Model Corner Terminals Interior Terminals |
VESD | ±4000 ±2500 ±200 750 500 |
V |
| THERMAL RATINGS | |||
| Operating Temperature Ambient Junction Case |
TA TJ TC |
- 40 to 125 - 40 to 150 - 40 to 125 |
°C |
| Storage Temperature | TSTG | - 55 to 150 | °C |
| Power Dissipation (3) | PD | 1.7 | °C |
| Thermal Resistance Junction to Ambient Between the Die and the Exposed Die Pad(4) |
RJA RJC |
71 1.2 |
°C/W |
| Peak Package Reflow Temperature During Solder Mounting (5) | TSOLDER | 245 | °C |
MC33975
PDF/DataSheet Download








