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Package Cooled:DIP  D/C:84+  

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Part Number: MC54HC00

 

 

Package Cooled: DIP

D/C: 84+

 

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MC54HC00 Maximum Ratings

Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) -0.5 to + 7.0 V
VIN DC Input Voltage (Referenced to GND) -0.5 to VCC+ 0.5 V
Vout DC Output Voltage (Referenced to GND) -0.5 to VCC+ 0.5 V
Iin DC Input Current, per Pin ±20 mA
Iout DC Output Current, per Pin ±25 mA
ICC DC Supply Current, VCC and GND Pins ±50 mA
PD Power Dissipation in Still Air,Plastic or Ceramic DIP+
SOIC Package+
TSSOP Package+
750
500
450
mW
Tstg Storage Temperature - 65 to + 150   
TL Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
Ceramic DIP
260
300
 

MC54HC00 Connection Diagram

MC54HC00  Connection Diagram

MC54HC00 datasheet

MC54HC00
PDF/DataSheet Download

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