Purchase MC54HC00, In-stock MC54HC00 From SeekIC.
Package Cooled:DIP D/C:84+

Package Cooled:DIP D/C:84+

| Symbol | Parameter | Value | Unit |
| VCC | DC Supply Voltage (Referenced to GND) | -0.5 to + 7.0 | V |
| VIN | DC Input Voltage (Referenced to GND) | -0.5 to VCC+ 0.5 | V |
| Vout | DC Output Voltage (Referenced to GND) | -0.5 to VCC+ 0.5 | V |
| Iin | DC Input Current, per Pin | ±20 | mA |
| Iout | DC Output Current, per Pin | ±25 | mA |
| ICC | DC Supply Current, VCC and GND Pins | ±50 | mA |
| PD | Power Dissipation in Still Air,Plastic or Ceramic DIP+ SOIC Package+ TSSOP Package+ |
750 500 450 |
mW |
| Tstg | Storage Temperature | - 65 to + 150 | |
| TL | Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package Ceramic DIP |
260 300 |
MC54HC00
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