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Package Cooled:TSSOP  

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Part Number: MC74HC02A

 

 

Package Cooled: TSSOP

 

 

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MC74HC02A Maximum Ratings

Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) -0.5 to + 7.0 V
Vin DC Input Voltage (Referenced to GND) -0.5toCC to + 0.5 V
Vout DC Output Voltage (Referenced to GND) -0.5toCC to + 0.5 V
Lin DC Input Current, per Pin ±20 mA
lout DC Output Current, per Pin ±25 mA
ICC DC Supply Current, V and GND Pins ±50 mA
PD

Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
TSSOP Package+

750

500

450

mVV
Tstg Storage Temperature - 65 to + 150
TL

Lead Temperature, 1 mm from Case for 10 Seconds

Plastic DIP, SOIC or TSSOP Package

260

MC74HC02A Features

The MC74HC02A is identical in pinout to the LS02. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 A
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard No. 7A
Chip Complexity: 40 FETs or 10 Equivalent Gates

MC74HC02A Connection Diagram

MC74HC02A  Connection Diagram

MC74HC02A datasheet

MC74HC02A
PDF/DataSheet Download

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