Purchase MC74HC259, In-stock MC74HC259 From SeekIC.
Package Cooled:SOP D/C:93+
Part Number: MC74HC259
Package Cooled: SOP
D/C: 93+
Description: The MC54/74HC259 is identical in pinout to the LS259. The device inputs are compatible with standard C...
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MC74HC259
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DataSheet
General Description
MC74HC259 General Description
The MC54/74HC259 is identical in pinout to the LS259. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
The HC259 has four modes of operation as shown in the mode selection table. In the addressable latch mode, the data on Data In is written into the addressed latch. The addressed latch follows the data input with all nonaddressed latches remaining in their previous states. In the memory mode, all latches remain in their previous state and are unaffected by the Data or Address inputs. In the oneofeight decoding or demultiplexing mode, the addressed output follows the state of Data In with all other outputs in the LOW state. In the Reset mode all outputs are LOW and unaffected by the address and data inputs. When operating the HC259 as an addressable latch, changing more than one bit of the address could impose a transient wrong address. Therefore, this should only be done while in the memory mode.
MC74HC259 Maximum Ratings
|
Symbol |
Parameter |
Value |
Unit |
|
VCC |
DC Supply Voltage (Referenced to GND) |
0.5 to +7.0 |
V |
|
Vin |
DC Input Voltage (Referenced to GND) |
1.5 to VCC +1.5 |
V |
|
Vout |
DC Output Voltage (Referenced to GND) |
0.5 to VCC + 0.5 |
V |
|
Iin |
DC Input Current, per Pin |
± 20 |
mA |
|
Iout |
DC Output Current, per Pin |
± 25 |
mA |
|
ICC |
DC Supply Current, VCC and GND Pins |
± 50 |
mA |
|
PD |
Power Dissipation in Still Air, Plastic or Ceramic DIP† SOIC Package† |
750 500 |
mW |
|
Tstg |
Storage Temperature |
65 to + 150 |
|
|
TL |
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) (Ceramic DIP) |
260 300 |
should be restricted to the Recommended Operating Conditions.
†Derating - Plastic DIP: 10 mW/ from 65 ° to 125
Ceramic DIP: 10 mW/ from 100 ° to 125
SOIC Package: 7 mW/ from 65 ° to 125
For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
MC74HC259 Features
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 A
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard No. 7A
• Chip Complexity: 202 FETs or 50.5 Equivalent Gates
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 A
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard No. 7A
• Chip Complexity: 202 FETs or 50.5 Equivalent Gates
MC74HC259 Connection Diagram
MC74HC259AD
PDF/DataSheet Download
- Datasheet: MC74HC259AD
- File Size: 252882 KB
- Manufacturer: MOTOROLA [Motorola, Inc]
- Click here to Download
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