MNADC10062CM-X

Supply Voltage (V+=AVcc=DVcc)........................-0.3V to +6V
Voltage at Any Input or Output................-0.3V to V+ + 0.3V
Input Current at Any Pin(Note 3)....................................5mA
Package Input Current
(Note 3)........................................................................20mA
Power Dissipation
(Note 4)......................................................................875mW
ESD Susceptability
(Note 5).......................................................................2000V
Soldering Information
(10 Sec.) ......................................................................300 C
Storage Temperature Range........................-65 C to +150 C
Junction Temperature...................................................150 C
Thermal Resistance
ThetaJA
(Still Air) ....................................................................51 C/W
(500LF/Min Air flow) ..................................................29 C/W
ThetaJC ....................................................................4.8 C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional. These ratings do not guarantee specific performance limits, however. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance.characteristics may degrade when the device is not operated under the listed test.conditions.
Note 2: All voltages are measured with respect to Gnd, unless otherwise specified.
Note 3: When the input voltage (Vin) at any pin exceeds the power supply rails (Vin < Gnd or.Vin > V+) the absolute value of current at that pin should be limited to 5mA or less..The 20mA package input current limits the number of pins that can safely exceed the.power supplies with an input current of 5mA to four.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is.dictated by Tjmax, ThetaJA and the ambient temperature, TA. The maximum allowable.power dissipation at any temperature is Pd = (Tjmax - TA)/ThetaJA or the number given.in the Absolute Maximum Ratings, whichever is lower. In most cases, the maximum.derated power dissipation will be reached only during fault conditions. For this.device, Tjmax is 150 C.
Note 5: Human body model, 100pF discharged through a 1.5K Ohm resistor.

Using an innovative, patented multistep* conversion technique, the 10-bit ADC10062 CMOS analog-to-digital converter offers sub-microsecond conversion times yet dissipates a maximum of only 235mW.  ADC10062  performs a 10-bit conversion in two lower-resolution "flashes" thus yielding a fast A/D without the cost, power dissipation, and other problems associated with true flash approaches.

The analog input voltage to the ADC10062 is sampled and held by an internal sampling circuit. Input signals at frequencies from dc to over 200KHz can therefore be digitized accurately without the need for an external sample-and-hold circuit.

The ADC10062 includes a speed-up pin. Connecting an external resistor between this pin and ground reduces the typical conversion time to as little as 350nS with only a small increase in linearity error.

For ease of interface to microprocessors, the ADC10062 has been designed to appear as a memory location or I/O port without the need for external interface logic. * U.S. Patent Number 4918449