MNLMX2325-X

Power Supply Voltage
         Vcc.............. -0.3V to +6.5V
          Vp ..............-0.3V to +6.5V
Voltage on Any Pin
with Gnd = 0V (Vi)..... . ...-0.3V to +6.5V
Storage Temperature Range (Ts)
                         ..........-65 C to +150 C
Power Dissipation
   (Note 2)
       Pd ...................1 Watt
Junction Temperature
   (Note 2)
       Tj ...................+150 C
Lead Temperature (Tl)
          (Solder, 4 sec.)........ ...+260 C
Thermal Resistance
   (Note 2)
      ThetaJA
          (Still Air) ........... . .120 C/W
          (500LF/Min Air Flow)........ 86 C/W
      ThetaJC..... ........ .. 19 C/W
Package Weight
        (Typical) ...............600mg
ESD Tolerance
   (Note 3)
                      ..........Less Than 500V

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guaranteed specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient theraml resistance), and TA (ambient temperature). The maximum allowable power dissiaption at any temperature is Pdmax = (Tjmax -TA) /ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower.

Note 3: This device is a high performance RF integrated circuit with an ESD rating <500V and is ESD sensitive. Handling and assembly of this device should be done at ESD workstations.