MOC223-M General Description
MOC223-M Features
• U.L. Recognized (File #E90700, Volume 2)
• VDE Recognized (File #136616) (add option "V" for VDE approval, i.e, MOC223V-M)
• Industry Standard SOIC-8 Surface Mountable Package with 0.050" lead spacing
• High Current Transfer Ratio of 500% Minimum at I F= 1 mA
• Standard SOIC-8 Footprint, with 0.050" Lead Spacing
• Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
• High Input-Output Isolation Voltage of 2500 V AC(rms) Guaranteed
MOC223-M Typical Application
• Low Power Logic Circuits
• Interfacing and coupling systems of different potentials and impedances
• Telecommunications equipment
• Portable electronics
• Solid state relays
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