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MFG:.  Package Cooled:.  D/C:07+  

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Part Number: MSL-174UG

 

MFG: .

Package Cooled: .

D/C: 07+

Description: The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT asse...


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MSL-174UG General Description


The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

MSL-174UG Maximum Ratings

Parameter
Symbol
Maximum Rating
Unit
Peak Forward Current(1/10 Duty Cycle@1KHz )
IFP
100
mA
DC Forward Current
IF
25
mA
Power Dissipation
PD
68
mW
Reverse Voltage
VR
5
V
Operating Temperature Range
TOPR
-20 to +80
Storage Temperature Range
TSTG
-30 to +100

MSL-174UG Features

· Push-Button Backlighting
· LCD Backlighting
· Symbol Backlighting
· Front Panel Indicator

MSL-174UG Typical Application

· Small Size
· Industry Standard Footprint(0805)
· Compatible with IR Solder process
· Availalble in 8 mm Tape on 7"(178mm) Diameteer Reels

MSL-174UG datasheet

MSL-174UG
PDF/DataSheet Download

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Related Part Number

MSL-174UG Relative Products

  • MSL-174TG

    MSL-174TG

    The MSL-174TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.

  • MSL-174SO

    MSL-174SO

    The MSL-174SO, a ORANGE source Chip ED device, is designed in an indnstry tandard package suitable for SMT assembly ethod. It utilizes GaAsP on GaP LED chip echnology and water clear epoxy package.

  • MSL-174SG

    MSL-174SG

    The MSL-174SG, a SIGNAL GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.

  • MSL-174HR

    MSL-174HR

    The MSL-174HR, a ORANGE source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaAsP on GaP LED chip technology nd water clear epoxy package.

  • MSL-174HG

    MSL-174HG

    The MSL-174HG, a GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaP on GaP LED chip technology nd water clear epoxy package.

  • MSL-174G

    MSL-174G

    The MSL-174G, a GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaP on GaP LED chip technology nd water clear epoxy package.

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